METALLIZED FILM FOR FILM CAPACITOR AND FILM CAPACITOR

PROBLEM TO BE SOLVED: To provide a film capacitor having a high dielectric constant and excellent resistance to thermal peeling (adhesion). SOLUTION: A metallized film for film capacitor has a polypropylene film or a polyethylene terephthalate film as a substrate, wherein a metallized film is formed...

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Bibliographische Detailangaben
Hauptverfasser:	SAKURAI TAKESHI, AIDA MASAYUKI, KOUCHI TETSUYA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CAPACITORS CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a film capacitor having a high dielectric constant and excellent resistance to thermal peeling (adhesion). SOLUTION: A metallized film for film capacitor has a polypropylene film or a polyethylene terephthalate film as a substrate, wherein a metallized film is formed on the fluorinated or sulfonated surface of the substrate. Preferably, (1) the fluorine atom concentration on the surface of a polypropylene film substrate is 5-48 at%, or the sulfur atom concentration is 1-23 at%, (2) the fluorine atom concentration on the surface of a polyethylene terephthalate film substrate is 2-50 at%, or the sulfur atom concentration is 1-30 at% or less. A film capacitor manufactured by the metallized film is also provided. COPYRIGHT: (C)2011,JPO&INPIT