METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress contamination of a chip mounting surface side of a semiconductor device. SOLUTION: This invention relates to a method of manufacturing the semiconductor device including a dicing step of dividing a wiring substrate 20 on which semiconductor chips are mounted into a...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ASARI TADASHI, FUJISHIMA ATSUSHI, TAKIZAWA TAKEHIKO, HARADA HARUHIKO, MUNAKATA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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