METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To suppress contamination of a chip mounting surface side of a semiconductor device. SOLUTION: This invention relates to a method of manufacturing the semiconductor device including a dicing step of dividing a wiring substrate 20 on which semiconductor chips are mounted into a plurality using a dicing blade 50. The dicing step is carried out such that the dicing blade 50 is run from the side of a reverse surface 10b of the wiring substrate 20 in a state wherein a dicing tape 36 is stuck on a top surface 10a of the wiring substrate 20 on the side a chip mounting surface. A portion nearby a region to be cut with the dicing blade 50 is sealed with the dicing tape 36, so that the contamination of the chip mounting surface (top surface 10a) side with foreign matter accompanying a cutting liquid 57 is suppressed. COPYRIGHT: (C)2011,JPO&INPIT