CLEANING METHOD

PROBLEM TO BE SOLVED: To remove hardly-deterged dirt stuck to an electronic component or a precision machining component having a fine structure or a fine micromachining die by lowering an environment load on cleaning as much as possible and without giving biased physical load which is likely to des...

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Bibliographische Detailangaben
Hauptverfasser:	SHIMIZU AKIO, KAJIWARA YUTA, KAMIMURA YOSHIAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL SURFACE TREATMENT CHEMISTRY CLEANING OR DEGREASING OF METALLIC MATERIAL BY CHEMICALMETHODS OTHER THAN ELECTROLYSIS COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To remove hardly-deterged dirt stuck to an electronic component or a precision machining component having a fine structure or a fine micromachining die by lowering an environment load on cleaning as much as possible and without giving biased physical load which is likely to destroy a structure. SOLUTION: The hardly-deterged dirt is removed by immersing an object to be cleaned in water, lower alcohol or surfactant solution and applying hydrostatic pressure of ultra-high pressure of 100 to 1,000 MPa to the object to be cleaned. COPYRIGHT: (C)2011,JPO&INPIT