METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of aligning a dicing blade when carrying out a dicing operation later, even if scribe lines are irradiated with a laser beam so as to remove an interlayer dielectric for prevention of chipping. SOLUTION: The m...

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Bibliographische Detailangaben
1. Verfasser:	KIDA TAKESHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device, capable of aligning a dicing blade when carrying out a dicing operation later, even if scribe lines are irradiated with a laser beam so as to remove an interlayer dielectric for prevention of chipping. SOLUTION: The method has a step of preparing a semiconductor wafer 1 which has the scribe line 3 and alignment marks 411, 412 formed on the scribe line, and a step of applying the laser beam to the scribe line 3 of the semiconductor wafer 1. In the step of applying the laser beam, laser irradiation is performed, so that at least one alignment mark 411, 412 remains. COPYRIGHT: (C)2011,JPO&INPIT