STAMPER POLISHING METHOD

PROBLEM TO BE SOLVED: To provide a stamper polishing method by which a stamper of sufficiently flat rear surface with uniform thickness can be manufactured. SOLUTION: When a polishing process is carried out on a second face 10b of the stamper 10, in a state where the platy stamper 10 in which an une...

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1. Verfasser: KAWAGUCHI YUICHI
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a stamper polishing method by which a stamper of sufficiently flat rear surface with uniform thickness can be manufactured. SOLUTION: When a polishing process is carried out on a second face 10b of the stamper 10, in a state where the platy stamper 10 in which an uneven pattern 15 is formed on a first face 10a is attached to a stamper holder 2, the polishing process is carried out, in a state where the whole area of the plate-like attachment part 2c of the stamper holder 2 touches the first face 10a of the stamper 10, the whole area of an uneven pattern forming area A1 in the first face 10a comes into contact with an attachment part 2c, and the stamper 10 is attached to the stamper holder 2 so that at least a part of an outer edge (outer edge area A2) of the stamper 10 sticks out of the outer edge of the attachment part 2c. COPYRIGHT: (C)2011,JPO&INPIT