EPOXY RESIN COMPOSITION FOR SEALING SEMICONDUCTOR

PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, widely improving the cleaning period of a mold. SOLUTION: This epoxy resin composition for sealing the semiconductor containing the epoxy resin, a curing agent, an inorganic filler and a mold-releasing agent is...

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1. Verfasser:	IKEDA HIRONORI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing a semiconductor, widely improving the cleaning period of a mold. SOLUTION: This epoxy resin composition for sealing the semiconductor containing the epoxy resin, a curing agent, an inorganic filler and a mold-releasing agent is characterized in that the mold-releasing agent is a reaction product of a higher fatty acid and an amino group-containing polysiloxane. COPYRIGHT: (C)2011,JPO&INPIT