CHEMICAL MECHANICAL POLISHING PAD AND CHEMICAL MECHANICAL POLISHING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To provide a chemical mechanical polishing pad capable of making compatible both the improvement of the flatness of a surface to be polished and the reduction of a polishing defect (scratch) in CMP, and a chemical mechanical polishing method using the pad. SOLUTION: The chemica...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	YOKOI KATSUTAKA, MAEKAWA AYAKO, SHIDA HIROTAKA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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