ELECTROCHEMICAL DEVICE
PROBLEM TO BE SOLVED: To provide an electrochemical device which can prevent the formation of a gap that communicates with the inside and outside of a film package in a sealing portion for terminal lead-out at reflow soldering. SOLUTION: An electrochemical device RB1 is provided with a film package...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!