ELECTROCHEMICAL DEVICE

PROBLEM TO BE SOLVED: To provide an electrochemical device which can prevent the formation of a gap that communicates with the inside and outside of a film package in a sealing portion for terminal lead-out at reflow soldering. SOLUTION: An electrochemical device RB1 is provided with a film package...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: ISHIDA KATSUHIDE, KAWAI HIROKI
Format: Patent
Sprache:eng
Schlagworte:
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