ELECTROCHEMICAL DEVICE
PROBLEM TO BE SOLVED: To provide an electrochemical device which can prevent the formation of a gap that communicates with the inside and outside of a film package in a sealing portion for terminal lead-out at reflow soldering. SOLUTION: An electrochemical device RB1 is provided with a film package...
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Format: | Patent |
Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide an electrochemical device which can prevent the formation of a gap that communicates with the inside and outside of a film package in a sealing portion for terminal lead-out at reflow soldering. SOLUTION: An electrochemical device RB1 is provided with a film package 14, having a sealing portion 14c for terminal lead-out; an electric storage element 11; and a terminal 12 having the rear end that is electrically connected with the electric storage element 11 and the front portion led outside the film package 14 through the sealing portion 14c for terminal lead-out. The film package 14 has a support portion 14d on the side of the sealing portion 14c for terminal lead-out; the terminal 12 is provided with a heat-seal assisting member 13 to surround a portion of the same; the rear side portion of the heat-seal assisting member 13 is positioned in the sealing portion 14c for terminal lead-out, and is integrated with heat seal layers LF3 during the time, when they are thermally bonded with each other; and he front portion of the heat-seal assisting member 13 is projected to the front from the sealing portion 14c for terminal lead-out and located on the supporting portion 14d. COPYRIGHT: (C)2011,JPO&INPIT |
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