WAFER INSPECTION DEVICE, AND WAFER INSPECTION METHOD

PROBLEM TO BE SOLVED: To simplify appearance inspection of a wafer by solving the problems of impossibility of appropriate comparison of an inspected image of the wafer with a good item image, of the time taken for imaging the entire surface of the wafer and complication of an inspecting process, and of the time taken for selecting an optimum lens. SOLUTION: A region for every intermediate lens 5 to be incorporated into a lens system according to an imaging object portion for imaging the wafer 1 and for every focal length is set in advance, whereby in scanning the entire surface of the wafer 1, the intermediate lens 5 to be incorporated into the lens system can be changed according to the set region to change the focal length of the lens system even when the wafer 1 is corrugated and the focal length is different for different imaging object portion for imaging the wafer 1. Then, in continuously imaging the surface of the wafer 1 so as to scan the entire surface of the wafer 1, the wafer 1 can be imaged by the lens system of the focal length suited for imaging each region and the inspected image of the wafer 1 which is in focus on the entire surface can be readily obtained. COPYRIGHT: (C)2011,JPO&INPIT