DATA PROCESSING DEVICE, POLISHING APPARATUS, METHOD FOR ESTIMATING POLISHING RATE, AND PROGRAM

PROBLEM TO BE SOLVED: To increase the accuracy of estimation of a polishing rate by using polished portion temperature information in each time range and information on a physical quantity other than the temperature. SOLUTION: A data processing device detects the temperature of a polished portion du...

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Bibliographische Detailangaben
1. Verfasser:	SHINOZAKI TSUTOMU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To increase the accuracy of estimation of a polishing rate by using polished portion temperature information in each time range and information on a physical quantity other than the temperature. SOLUTION: A data processing device detects the temperature of a polished portion during polishing and detects a predetermined physical quantity other than temperature which is related to the rate of polishing (S1). At least two different time ranges are set in the period of polishing according to the trend of temporal change in the detected temperature (S2). The polishing rate is estimated from the polished portion temperature information in each time range and the information on the physical quantity other than temperature (S3). COPYRIGHT: (C)2011,JPO&INPIT