SOLDER CONNECTION STRUCTURE AND DISPLAY DEVICE WITH THE SAME

PROBLEM TO BE SOLVED: To visually determine whether conductive films are soldered to each other normally. SOLUTION: A solder connection structure is constituted by arranging a sub wiring board 8 having a second wiring 82a formed on a main wiring board 6 having a first wiring 62a formed so that the s...

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Bibliographische Detailangaben
Hauptverfasser: YUSA KATSUHIKO, OHASHI TAKAFUMI, YANAI NARUHITO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To visually determine whether conductive films are soldered to each other normally. SOLUTION: A solder connection structure is constituted by arranging a sub wiring board 8 having a second wiring 82a formed on a main wiring board 6 having a first wiring 62a formed so that the second wiring 82a corresponds to the first wiring 62a, and connecting the first wiring 62a and second wiring 82a together with solder 9, and one of the first wiring 62a and second wiring 82a at a portion where the first wiring 62a and second wiring 82a are covered with the solder 9, has a narrow-width portion formed by reducing the width of one of the wirings. COPYRIGHT: (C)2011,JPO&INPIT