COOLER

PROBLEM TO BE SOLVED: To provide a cooler with a high cooling performance and suppressing a failure of a heating element. SOLUTION: The cooler includes: a heat pipe 15c press-fitted in heat receiving portions 14a, 14b, 14c transmitted with heat generated by heating elements 9a, 9b, 9c and provided h...

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Bibliographische Detailangaben
Hauptverfasser:	SUGAWARA HIROMASA, YOSHIHARA TOSHIKAZU, KOBAYASHI HIDETAKA, SAWAGUCHI MASA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a cooler with a high cooling performance and suppressing a failure of a heating element. SOLUTION: The cooler includes: a heat pipe 15c press-fitted in heat receiving portions 14a, 14b, 14c transmitted with heat generated by heating elements 9a, 9b, 9c and provided higher in position than the heating elements 9a, 9b, 9c; a support 12 transmitted with heat generated by the heating elements 9a, 9b, 9c and provided lower in position than the heating elements 9a, 9b, 9c; and a first flow path 5 in which a coolant cooling the support 12 flows. Accordingly, failures of the heating elements 9a, 9b, 9c are reduced while keeping the cooling performance of the heating elements 9a, 9b, 9c. COPYRIGHT: (C)2011,JPO&INPIT