CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME, SEMICONDUCTOR DEVICE, AND ELECTRONIC CIRCUIT DEVICE

PROBLEM TO BE SOLVED: To provide a structure that improves resistance of, especially, portable electronic equipment against a shock of a fall etc. without sealing the part between a semiconductor device and a circuit board with a resin called underfill, and contributes to size reduction without impeding height reduction in such a case, and that is actualized inexpensively. SOLUTION: In an electronic circuit device including the circuit board, a semiconductor having a semiconductor chip mounted on the circuit board and a mother board to which the semiconductor device is connected, each of electrode structures 1 of them has: a recess 4 recessed from a surface; a projection 5 of a resin provided in the recess 4; and a wiring layer 6 covering the recess 4 and a surface of the projection 5. Such the electrode structure 1 reduces a connection height and enhances shock resistance. COPYRIGHT: (C)2011,JPO&INPIT