METHOD OF MANUFACTURING WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board for filling an intended part with an insulating material reliably, and preventing the material from flowing into an unintended part. SOLUTION: The method of manufacturing the substrate 1 is equipped with: a core substrate 11 i...
Gespeichert in:
Hauptverfasser: | , , , , |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board for filling an intended part with an insulating material reliably, and preventing the material from flowing into an unintended part. SOLUTION: The method of manufacturing the substrate 1 is equipped with: a core substrate 11 including a storage unit 111 formed between main surfaces, a part 12 stored in the storage unit; and a filling unit 15 for blocking a gap between them. The method is equipped with processes of: (PR1) preparing a core substrate assembly AG including a connection core unit AG11 where a plurality of core substrates are connected and an outer unit AG13 that is disposed outside the connection core unit and includes a formed hole unit AG14, a process PR2 for disposing the part 12 in the storage unit; (PR3) disposing a film-like insulating material S15 on the first main surface, a process PR4 for disposing an elastic sheet 3 to cover an opening AG14s and the insulating material S15; and (PR5) heating and pressurizing the insulating material S15 for filling one portion of the filling material into the storage unit and forming the filling unit 15. COPYRIGHT: (C)2011,JPO&INPIT |
---|