METHOD OF MANUFACTURING WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board for filling an intended part with an insulating material reliably, and preventing the material from flowing into an unintended part. SOLUTION: The method of manufacturing the substrate 1 is equipped with: a core substrate 11 i...

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Bibliographische Detailangaben
Hauptverfasser: SAIDA KENICHI, HASHIMOTO HIROHITO, YAMASHITA DAISUKE, SUZUKI SHINYA, MIYAMOTO SHINYA
Format: Patent
Sprache:eng
Schlagworte:
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board for filling an intended part with an insulating material reliably, and preventing the material from flowing into an unintended part. SOLUTION: The method of manufacturing the substrate 1 is equipped with: a core substrate 11 including a storage unit 111 formed between main surfaces, a part 12 stored in the storage unit; and a filling unit 15 for blocking a gap between them. The method is equipped with processes of: (PR1) preparing a core substrate assembly AG including a connection core unit AG11 where a plurality of core substrates are connected and an outer unit AG13 that is disposed outside the connection core unit and includes a formed hole unit AG14, a process PR2 for disposing the part 12 in the storage unit; (PR3) disposing a film-like insulating material S15 on the first main surface, a process PR4 for disposing an elastic sheet 3 to cover an opening AG14s and the insulating material S15; and (PR5) heating and pressurizing the insulating material S15 for filling one portion of the filling material into the storage unit and forming the filling unit 15. COPYRIGHT: (C)2011,JPO&INPIT