METALLIZED POLYIMIDE FILM, AND FLEXIBLE WIRING BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a metallized polyimide film capable of obtaining a flexible wiring board reducing the elongation at the time of an OLB (Outer lead bonding) process to 50% of that of a conventional product, and a flexible wiring board using the same. SOLUTION: In the metallized polyi...

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Bibliographische Detailangaben

Hauptverfasser:	OGASAWARA SHUICHI, SONE HIROBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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