METALLIZED POLYIMIDE FILM, AND FLEXIBLE WIRING BOARD USING THE SAME

PROBLEM TO BE SOLVED: To provide a metallized polyimide film capable of obtaining a flexible wiring board reducing the elongation at the time of an OLB (Outer lead bonding) process to 50% of that of a conventional product, and a flexible wiring board using the same. SOLUTION: In the metallized polyi...

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Bibliographische Detailangaben
Hauptverfasser:	OGASAWARA SHUICHI, SONE HIROBUMI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS TRANSPORTING
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a metallized polyimide film capable of obtaining a flexible wiring board reducing the elongation at the time of an OLB (Outer lead bonding) process to 50% of that of a conventional product, and a flexible wiring board using the same. SOLUTION: In the metallized polyimide film wherein a metal film is directly provided on the surface of a polyimide film by a plating method, the polyimide film is characterized in that the water absorption of the polyimide film with a film thickness of 35-40 μm is 1-3 mass% and the coefficient of thermal expansion thereof is 3-8 ppm/°C in a TD direction (width direction) and 9-15 ppm/°C in an MD direction (longitudinal direction). COPYRIGHT: (C)2011,JPO&INPIT