CONTROLLED BOND WAVE OVER PATTERNED WAFER

CONTROLLED BOND WAVE OVER PATTERNED WAFER

PROBLEM TO BE SOLVED: To provide a controlled bond wave over a patterned wafer. SOLUTION: A method for bonding two substrates includes: a step of disposing a separating member between a first and a second substrates; a step of generating a bond wave between the first and the second substrates by add...

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Bibliographische Detailangaben
Hauptverfasser: DEMING STEVE, CHEN ZHENFANG, MILLER HUGO J, ROCCHIO MICHEAL
Format: Patent
Sprache:eng
Schlagworte:
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
TRANSPORTING
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a controlled bond wave over a patterned wafer. SOLUTION: A method for bonding two substrates includes: a step of disposing a separating member between a first and a second substrates; a step of generating a bond wave between the first and the second substrates by adding a pressure to the first substrate under a condition where the separating member is disposed between the first and the second substrates; and a step of controlling a movement of the bond wave by translating the separating member in a direction separating from a center of the first or the second substrate. COPYRIGHT: (C)2011,JPO&INPIT