METHOD OF MANUFACTURING LAMINATED BODY FOR ELECTRONIC CIRCUIT COMPONENT

PROBLEM TO BE SOLVED: To provide a laminated body for an electronic circuit component suppressed in dust generation during usage, in particular, a laminated body for wireless suspension for a hard disk drive. SOLUTION: In this method of manufacturing a laminated body for an electronic circuit component, a laminated body of a layer structure comprising a first inorganic substance layer, an insulation layer and a second inorganic substance layer or an inorganic substance layer and an insulation layer is patterned by being subjected to wet etching, and plasma treatment is performed to the insulation layer exposed by removing at least partial parts of the first inorganic substance layer, the second inorganic substance layer and the inorganic substance layer by being patterned. The insulation layer is an insulation unit layer of a single-layer structure or a laminated structure of two or more layers, and the material of the insulation unit layer is polyimide. COPYRIGHT: (C)2011,JPO&INPIT