DESIGN DRIVEN INSPECTION OR MEASUREMENT

PROBLEM TO BE SOLVED: To provide design driven inspection/metrology methods and apparatus in semiconductor wafer defect inspection or measurement. SOLUTION: A recipe 155 is a set of instructions including wafer processing parameters, inspection parameters, or control parameters for telling an inspec...

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Bibliographische Detailangaben
1. Verfasser:	BEVIS CHRISTOPHER F
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide design driven inspection/metrology methods and apparatus in semiconductor wafer defect inspection or measurement. SOLUTION: A recipe 155 is a set of instructions including wafer processing parameters, inspection parameters, or control parameters for telling an inspection/metrology system 150 how to inspect/measure a wafer 160. Design data is imported into a recipe extraction system 150, and the recipe extraction system 150 recognizes instances of target structures and configures recipe parameters accordingly, thereby reducing manual instrument setup time, improving inspection/measurement accuracy, and improving fabrication efficiency. COPYRIGHT: (C)2011,JPO&INPIT