ETCHING DEVICE

PROBLEM TO BE SOLVED: To provide an etching device, configured so that a substrate can be processed at relatively low cost while suppressing abnormal electrical discharge in application of a winding vacuum treatment device to a plasma processing device using RF power. SOLUTION: The etching device in...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	TAKEI HIDEO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY PLASMA TECHNIQUE PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OFNEUTRONS PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMICBEAMS SEMICONDUCTOR DEVICES
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