POLYESTER RESIN MOLDING AND MANUFACTURING METHOD THEREFOR

PROBLEM TO BE SOLVED: To provide a polyester resin molding capable of exhibiting transparency and crystallinity at high dimension, and a manufacturing method therefor. SOLUTION: This polyester resin molding is annealing-treated for 1 second to two minutes, after molding a polyester resin composition...

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Bibliographische Detailangaben
Hauptverfasser:	TSUNEIZUMI YOTA, URUSHIBARA TAKESHI, KAWAMOTO HISAFUMI
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyester resin molding capable of exhibiting transparency and crystallinity at high dimension, and a manufacturing method therefor. SOLUTION: This polyester resin molding is annealing-treated for 1 second to two minutes, after molding a polyester resin composition blended with 0.001-1 mass pts. of crystal nucleus agent comprising a polyester resin sulfone amide compound metal salt or a sulfone imide compound metal salt, per 100 mass pts. of polyester resin. There is provided a method of annealing-treating the polyester resin composition blended with 0.001-1 mass pts. of crystal nucleus agent comprising the polyester resin sulfone amide compound metal salt or the sulfone imide compound metal salt, per 100 mass pts. of polyester resin, at a temperature within a range of 100°C-200°C for 1 second to two minutes, after molding the polyester resin composition at 250°C-300°C. COPYRIGHT: (C)2011,JPO&INPIT