PRINTED WIRING BOARD, AND SILOXANE-BASED RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a printed wiring board, having an insulating protective film formed of a siloxane-based resin composition on a substrate including an insulating base, an adhesive and a wiring pattern, which is improved in electric (insulation) reliability more, and to provide a silo...

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Bibliographische Detailangaben
Hauptverfasser:	YAMASHITA HIROHISA, TAKABAYASHI SEIICHIRO
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board, having an insulating protective film formed of a siloxane-based resin composition on a substrate including an insulating base, an adhesive and a wiring pattern, which is improved in electric (insulation) reliability more, and to provide a siloxane-based resin composition capable of suitably improving the electric (insulation) reliability of the printed wiring board. SOLUTION: This invention relates to the printed wiring board which has the insulating protective film formed of the siloxane-based resin composition on the substrate including the insulating base, adhesive and wiring pattern, the siloxane-based resin composition containing 0.5 to 10 parts by mass of a compound having one or more hindered phenol groups in a molecule for 100 parts by mass of a resin component. COPYRIGHT: (C)2011,JPO&INPIT