RESIN MOLD COIL

RESIN MOLD COIL

PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method...

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1. Verfasser: TAKANO TETSUMI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
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creator TAKANO TETSUMI
description PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method of construction. SOLUTION: A coil 2 is wrapped with an insulating resin for integrated molding, and the molded layer 3 is enclosed to form a ground shield on its surface side by pairing an embedded shield 11 buried near the surface of the resin mold layer 3 excepting some surface area of the mold layer and an outer surface shield layer 10 layered on the outer surface of the mold layer 3 by covering a defective surface area of the embedded shield 11, wherein the embedded shield 11 is buried near the surface of the mold layer by covering the surface area of the inner and outer peripheral surfaces excepting the top and bottom end surfaces of the resin mold layer 3 whose outer shape is approximately in a cylindrical form, and the outer surface shield layer 10 is layered and coated in the surface area overlapping the top and bottom end surfaces of the embedded shield 11 by covering the top and bottom end surfaces of the mold layer 3. COPYRIGHT: (C)2011,JPO&INPIT
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2011134873A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2011134873A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2011134873A3</originalsourceid><addsrcrecordid>eNrjZOAPcg329FPw9fdxUXD29_ThYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGhsYmFubGjsZEKQIADjcdeg</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>RESIN MOLD COIL</title><source>esp@cenet</source><creator>TAKANO TETSUMI</creator><creatorcontrib>TAKANO TETSUMI</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method of construction. SOLUTION: A coil 2 is wrapped with an insulating resin for integrated molding, and the molded layer 3 is enclosed to form a ground shield on its surface side by pairing an embedded shield 11 buried near the surface of the resin mold layer 3 excepting some surface area of the mold layer and an outer surface shield layer 10 layered on the outer surface of the mold layer 3 by covering a defective surface area of the embedded shield 11, wherein the embedded shield 11 is buried near the surface of the mold layer by covering the surface area of the inner and outer peripheral surfaces excepting the top and bottom end surfaces of the resin mold layer 3 whose outer shape is approximately in a cylindrical form, and the outer surface shield layer 10 is layered and coated in the surface area overlapping the top and bottom end surfaces of the embedded shield 11 by covering the top and bottom end surfaces of the mold layer 3. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRICITY ; INDUCTANCES ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2011</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110707&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011134873A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20110707&amp;DB=EPODOC&amp;CC=JP&amp;NR=2011134873A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TAKANO TETSUMI</creatorcontrib><title>RESIN MOLD COIL</title><description>PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method of construction. SOLUTION: A coil 2 is wrapped with an insulating resin for integrated molding, and the molded layer 3 is enclosed to form a ground shield on its surface side by pairing an embedded shield 11 buried near the surface of the resin mold layer 3 excepting some surface area of the mold layer and an outer surface shield layer 10 layered on the outer surface of the mold layer 3 by covering a defective surface area of the embedded shield 11, wherein the embedded shield 11 is buried near the surface of the mold layer by covering the surface area of the inner and outer peripheral surfaces excepting the top and bottom end surfaces of the resin mold layer 3 whose outer shape is approximately in a cylindrical form, and the outer surface shield layer 10 is layered and coated in the surface area overlapping the top and bottom end surfaces of the embedded shield 11 by covering the top and bottom end surfaces of the mold layer 3. COPYRIGHT: (C)2011,JPO&amp;INPIT</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2011</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAPcg329FPw9fdxUXD29_ThYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoaGhsYmFubGjsZEKQIADjcdeg</recordid><startdate>20110707</startdate><enddate>20110707</enddate><creator>TAKANO TETSUMI</creator><scope>EVB</scope></search><sort><creationdate>20110707</creationdate><title>RESIN MOLD COIL</title><author>TAKANO TETSUMI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2011134873A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2011</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>TAKANO TETSUMI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TAKANO TETSUMI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RESIN MOLD COIL</title><date>2011-07-07</date><risdate>2011</risdate><abstract>PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method of construction. SOLUTION: A coil 2 is wrapped with an insulating resin for integrated molding, and the molded layer 3 is enclosed to form a ground shield on its surface side by pairing an embedded shield 11 buried near the surface of the resin mold layer 3 excepting some surface area of the mold layer and an outer surface shield layer 10 layered on the outer surface of the mold layer 3 by covering a defective surface area of the embedded shield 11, wherein the embedded shield 11 is buried near the surface of the mold layer by covering the surface area of the inner and outer peripheral surfaces excepting the top and bottom end surfaces of the resin mold layer 3 whose outer shape is approximately in a cylindrical form, and the outer surface shield layer 10 is layered and coated in the surface area overlapping the top and bottom end surfaces of the embedded shield 11 by covering the top and bottom end surfaces of the mold layer 3. COPYRIGHT: (C)2011,JPO&amp;INPIT</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRICITY
INDUCTANCES
MAGNETS
SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
TRANSFORMERS
title RESIN MOLD COIL
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-23T08%3A05%3A11IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=TAKANO%20TETSUMI&rft.date=2011-07-07&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2011134873A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true