RESIN MOLD COIL

PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method...

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Bibliographische Detailangaben
1. Verfasser: TAKANO TETSUMI
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin mold coil that has been so improved as to build a shield of ground potential and high shielding functionality with reliability by skillfully combining an embedded shield and an outer surface shield layer on the surface side of the mold coil by a simple method of construction. SOLUTION: A coil 2 is wrapped with an insulating resin for integrated molding, and the molded layer 3 is enclosed to form a ground shield on its surface side by pairing an embedded shield 11 buried near the surface of the resin mold layer 3 excepting some surface area of the mold layer and an outer surface shield layer 10 layered on the outer surface of the mold layer 3 by covering a defective surface area of the embedded shield 11, wherein the embedded shield 11 is buried near the surface of the mold layer by covering the surface area of the inner and outer peripheral surfaces excepting the top and bottom end surfaces of the resin mold layer 3 whose outer shape is approximately in a cylindrical form, and the outer surface shield layer 10 is layered and coated in the surface area overlapping the top and bottom end surfaces of the embedded shield 11 by covering the top and bottom end surfaces of the mold layer 3. COPYRIGHT: (C)2011,JPO&INPIT