PHOTOSENSITIVE AND THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF

PROBLEM TO BE SOLVED: To provide a polyimide resin composition with high heat resistance, which is cured with ultraviolet and/or a temperature of 150°C or lower, which causes the little generation of cracked gas even when heated to 250°C, and which provides flexible and adhesive cured products. SOLU...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIHARA HIDETA, MIFUJI TAKESHI, OISHI JITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
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