PHOTOSENSITIVE AND THERMOSETTING POLYIMIDE RESIN COMPOSITION AND CURED PRODUCT THEREOF

PROBLEM TO BE SOLVED: To provide a polyimide resin composition with high heat resistance, which is cured with ultraviolet and/or a temperature of 150°C or lower, which causes the little generation of cracked gas even when heated to 250°C, and which provides flexible and adhesive cured products. SOLU...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	KIHARA HIDETA, MIFUJI TAKESHI, OISHI JITSUO
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a polyimide resin composition with high heat resistance, which is cured with ultraviolet and/or a temperature of 150°C or lower, which causes the little generation of cracked gas even when heated to 250°C, and which provides flexible and adhesive cured products. SOLUTION: The photosensitive and thermosetting polyimide resin composition contains a polyimide (B) wherein the main chain contains a repeating unit having a polyoxyalkylene diamine structure and a group containing an acrylic group is chemically bound to the molecular ends, and a polymerization initiator. A cured product is produced by photo- and/or heat-curing of the polyimide resin composition. COPYRIGHT: (C)2011,JPO&INPIT