WIRING BOARD, METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To obtain a wiring board with a highly insulating and heat-radiating insulating layer at low cost. SOLUTION: The wiring board 100 is produced by using a base metal member 1 as a base material, and the insulating layer 2 formed by spraying aluminum oxide-containing ceramics fine...

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Bibliographische Detailangaben
Hauptverfasser:	EGOTA KAZUMI, OKAMOTO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To obtain a wiring board with a highly insulating and heat-radiating insulating layer at low cost. SOLUTION: The wiring board 100 is produced by using a base metal member 1 as a base material, and the insulating layer 2 formed by spraying aluminum oxide-containing ceramics fine particles onto a surface of the base metal member as material powder. The crystal transformation index of the insulating layer, which is obtained from the diffraction intensity by an X-ray diffraction method, is at least a predetermined value, and preferably at least 0.6. COPYRIGHT: (C)2011,JPO&INPIT