SEMICONDUCTOR DEVICE AND BOARD FOR THE SAME

PROBLEM TO BE SOLVED: To achieve a structure for making constant the thickness of a build-up substrate and preventing the displacement of a bump at a flip-chip junction by making an equal proportion of a wiring pattern formed on a core substrate or an insulating resin film. SOLUTION: A semiconductor device 5 has the build-up substrate 6a including: the core substrate 31 with a uniform thickness; the wiring pattern 61 formed on the core substrate 31; the insulating resin film covering the core substrate 31 and the wiring pattern 61; and a bump connection electrode 34 formed on the insulating resin film, wherein the semiconductor device 5 connects the build-up substrate 6a to a semiconductor element 4 via the bump 42 formed on the bump connection electrode 34. The thickness of the insulating resin film 62 is equalized by equalizing the proportion of the wiring pattern 61 to be formed on the core substrate 31 and the thickness of the build-up substrate 6a is also equalized, thereby preventing the displacement of the bump at the flip-chip junction. COPYRIGHT: (C)2011,JPO&INPIT