CONNECTOR MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF CONNECTOR MOUNTING SUBSTRATE

CONNECTOR MOUNTING SUBSTRATE AND MANUFACTURING METHOD OF CONNECTOR MOUNTING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a connector mounting substrate capable of securing a mountable area of a soldered part at a low cost, and suppressing the limit of a layout of a control substrate and a connector. SOLUTION: A connector 20A is arranged so as to overhang outside a side 12s of a control...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: NAGAI RYUICHI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
CURRENT COLLECTORS
ELECTRICITY
LINE CONNECTORS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a connector mounting substrate capable of securing a mountable area of a soldered part at a low cost, and suppressing the limit of a layout of a control substrate and a connector. SOLUTION: A connector 20A is arranged so as to overhang outside a side 12s of a control substrate 12, and thereby an occupied area of the connector 20A on the controlling substrate 12 can be made small to increase an area where other components can be mounted. Since the occupied area of the connector 20A on the control substrate 12 is small, a soldered part is not interfered by the connector 20A and the inspection of the soldered part on a surface of the control substrate 12 can be carried out by a CCD camera 100. COPYRIGHT: (C)2011,JPO&INPIT