ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To provide an electronic apparatus allowing further enhancement of mounting efficiency of a board. SOLUTION: The electronic apparatus includes: the board 7 stored in the inside Is of a casing 2a; an element 8 mounted on the board 7; a heat reception component 9 disposed on the...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MIKAMI MASASHI, KONNO TOSHIKAZU
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide an electronic apparatus allowing further enhancement of mounting efficiency of a board. SOLUTION: The electronic apparatus includes: the board 7 stored in the inside Is of a casing 2a; an element 8 mounted on the board 7; a heat reception component 9 disposed on the element 8; a heat pipe 10 disposed on the element 8, transferring heat received from the heat reception component 9 to a heat radiation part 10b; and a pressing member 11 pressing at least one of the heat reception component 9 and the heat pipe 10 toward the element 8. An installation part 11c of the pressing member 11 is installed to the casing 2a. COPYRIGHT: (C)2011,JPO&INPIT