FILMY BODY OF POLYAMIDE RESIN AND METHOD FOR PRODUCING THE SAME

PROBLEM TO BE SOLVED: To provide a filmy body which has generality of being produced even by the application of a water-cooling inflation film-making method of a nylon 6 resin, and of which the winding up is reduced; and to provide a method for producing the filmy body. SOLUTION: The filmy body is c...

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Bibliographische Detailangaben
Hauptverfasser:	TACHIBANA YASUHITO, HATTORI KEIICHI, KARASAWA HIROO
Format:	Patent
Sprache:	eng
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS GENERAL PROCESSES OF COMPOUNDING INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a filmy body which has generality of being produced even by the application of a water-cooling inflation film-making method of a nylon 6 resin, and of which the winding up is reduced; and to provide a method for producing the filmy body. SOLUTION: The filmy body is constituted of a polyamide resin composition obtained by compounding the following components (A) and (B), and has 5-300 μm of the film thickness: (A) 100 pts.wt. of a polyamide resin A having 3.0-5.0 of relative viscosity in sulfuric acid; and (B) 0.1-4 pts.wt. of master pellets obtained by compounding the following components (i) and (ii): (i) 100 pts.wt. of a polyamide resin B having ≥2.0 of relative viscosity in the sulfuric acid and smaller than that of the polyamide A; and (ii) 2-20 pts.wt. of a bisamide compound represented by the general formula: R1-CONH(CH2)2NHCO-R2(wherein, R1and R2are each 12-32C hydrocarbon, and may be the same or different). COPYRIGHT: (C)2011,JPO&INPIT