BONDING METHOD OF CORE OF CONNECTOR, AND OPTICAL MODULATOR MODULE MANUFACTURED THEREBY

PROBLEM TO BE SOLVED: To provide a bonding method of a high frequency connector applied to connection between an optical device or an electronic device and an electric driver for driving the devices, and to provide an optical modulator module manufactured thereby. SOLUTION: In this bonding method of...

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Bibliographische Detailangaben
Hauptverfasser:	IGARASHI NOBUHIRO, NANAMI MASAYA, KONO KENJI
Format:	Patent
Sprache:	eng
Schlagworte:	DEVICES OR ARRANGEMENTS, THE OPTICAL OPERATION OF WHICH ISMODIFIED BY CHANGING THE OPTICAL PROPERTIES OF THE MEDIUM OF THEDEVICES OR ARRANGEMENTS FOR THE CONTROL OF THE INTENSITY,COLOUR, PHASE, POLARISATION OR DIRECTION OF LIGHT, e.g.SWITCHING, GATING, MODULATING OR DEMODULATING FREQUENCY-CHANGING NON-LINEAR OPTICS OPTICAL ANALOGUE/DIGITAL CONVERTERS OPTICAL LOGIC ELEMENTS OPTICS PHYSICS TECHNIQUES OR PROCEDURES FOR THE OPERATION THEREOF
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a bonding method of a high frequency connector applied to connection between an optical device or an electronic device and an electric driver for driving the devices, and to provide an optical modulator module manufactured thereby. SOLUTION: In this bonding method of a core of the connector for bonding an electrode formed on a substrate to the core of the connector arranged separately as far as a prescribed distance over the electrode by using a solder pellet, the solder pellet formed thicker than the prescribed distance and arranged in contact with or close to the core of the connector, is heated, and thereby the solder pellet is melted, and the molten solder comes between the core and the electrode by capillary phenomenon, to thereby bond the core to the electrode. COPYRIGHT: (C)2011,JPO&INPIT