LASER PATTERNING METHOD AND APPARATUS THEREFOR

PROBLEM TO BE SOLVED: To provide a laser patterning apparatus, wherein time loss during movement of a substrate is reduced to improve TAT (Turn Around Time) and defective machining due to focus deviation is reduced. SOLUTION: The laser patterning apparatus is provided with a mechanism which scans a...

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Hauptverfasser:	KOIZUMI MITSUYOSHI, YAMAGUCHI HIROKATSU, HONGO MIKIO, ARAKI MASAKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS PERFORMING OPERATIONS PHYSICS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a laser patterning apparatus, wherein time loss during movement of a substrate is reduced to improve TAT (Turn Around Time) and defective machining due to focus deviation is reduced. SOLUTION: The laser patterning apparatus is provided with a mechanism which scans a laser beam in a direction (subsidiary direction) vertical to a substrate scanning direction (main direction), and the scanning in the subsidiary direction is performed in accordance with the generation of laser pulse to allow the concurrent machining of a plurality of grooves by means of low-speed movement of the substrate, so that the time loss during movement of the substrate is reduced to improve the TAT and stability of focus control is improved to reduce the defective machining. COPYRIGHT: (C)2011,JPO&INPIT