METHOD FOR MANUFACTURING HEAD GIMBAL ASSEMBLY AND APPARATUS FOR INTERCONNECTING CONNECTING PAD OF THE HEAD GIMBAL ASSEMBLY

PROBLEM TO BE SOLVED: To improve productivity of a head gimbal assembly. SOLUTION: In one embodiment of the invention, a nozzle 21 holds a solder ball 32 near the injection opening. The nozzle 21 has a hole near the solder ball holding part separately from the solder ball injection opening. In a sta...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	OSAWA HIDENORI, IMAI HIDETO, TSUCHIYA TATSUMI, YOSHIDA TATSUSHI, MATSUMOTO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve productivity of a head gimbal assembly. SOLUTION: In one embodiment of the invention, a nozzle 21 holds a solder ball 32 near the injection opening. The nozzle 21 has a hole near the solder ball holding part separately from the solder ball injection opening. In a state that the solder ball 32 is held by the nozzle 21, the held solder ball 32 is irradiated with a laser beam, while making an inert gas supplied to the nozzle 21 flow out from the hole of the nozzle 21. The solder ball 32 is fused, and the fused solder is blown off toward connecting pads 121, 144 from the injection opening of the nozzle by the inert gas. Since no time difference is present between the fusion and the blowing-off of the solder, the fused solder hardly remains in the nozzle 21, and clogging hardly occurs in the solder holding part. COPYRIGHT: (C)2011,JPO&INPIT