MULTILAYER WIRING BOARD, AND METHOD OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a high-density multilayer wiring board excellent in flip-chip connectivity and wire bond connectivity, and also capable of securing a filter function when used as a wiring board composing a SAW device, and to provide a method of manufacturing the multilayer wiring bo...

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Hauptverfasser:	ISHIHARA MITSUYASU, KODAIRA MASAYUKI, NISHIDA TAKANORI, ISODA SATOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a high-density multilayer wiring board excellent in flip-chip connectivity and wire bond connectivity, and also capable of securing a filter function when used as a wiring board composing a SAW device, and to provide a method of manufacturing the multilayer wiring board. SOLUTION: The multilayer wiring board includes wiring patterns and insulating layers provided alternately and has an interlayer connection penetrating through each insulating layer to connect between the wiring patterns. In the multilayer wiring board and a method of manufacturing the multilayer wiring board, the interlayer connection is formed by filled vias formed by plating, and the wiring pattern in the outermost layer is formed of a metal foil arranged on the interlayer connection and connected to the filled vias formed by plating. COPYRIGHT: (C)2011,JPO&INPIT