SEMICONDUCTOR MANUFACTURING APPARATUS

PROBLEM TO BE SOLVED: To solve such a problem wherein semiconductor chips can not be picked up directly from a coherent aggregate of a lot of semiconductor chips formed in a diced semiconductor wafer in order to enable packaging of the aggregate on a circuit board with mass productivity. SOLUTION: The semiconductor manufacturing apparatus has: a pickup chuck which cleaves and isolates one row of a plurality of semiconductor chips and performs vacuum sucking of the semiconductor chips from the end of a semiconductor wafer on a first plate mounting the diced semiconductor wafer; a second plate on which the semiconductor chips of the pickup chuck are aligned; and a pickup chuck moving means which moves the pickup chuck to the second plate. The suction surface of the pickup chuck forms such a slope that a gap with respect to the semiconductor chip is narrow on the side close to the dicing line for cleavage isolation, and is wider as receding from the dicing line. COPYRIGHT: (C)2011,JPO&INPIT