SUBSTRATE MOUNTING BASE, METHOD FOR MANUFACTURING THE SAME, AND SUBSTRATE PROCESSING APPARATUS

PROBLEM TO BE SOLVED: To provide a mounting base for effectively preventing etching unevenness without damaging a substrate. SOLUTION: The mounting base 5A includes a base material 7 formed of a conductive material such as aluminum or stainless steel (SUS) and an insulating film 8 arranged on the ba...

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Bibliographische Detailangaben
Hauptverfasser:	MINAMI MASAHITO, OKUYAMA KOICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a mounting base for effectively preventing etching unevenness without damaging a substrate. SOLUTION: The mounting base 5A includes a base material 7 formed of a conductive material such as aluminum or stainless steel (SUS) and an insulating film 8 arranged on the base material 7. The upper surface of the insulating film 8 is made as a substrate mounting surface 50 for mounting a glass substrate S for FPD. The substrate mounting surface 50 includes a rough part 51 having a rough surface with a surface roughness Ra of ≥2 μm and ≤6 μm and a flat part 53 with a surface roughness Ra of