HYBRID RELAY

PROBLEM TO BE SOLVED: To provide a hybrid relay capable of preventing a semiconductor switch from getting highly heated. SOLUTION: The hybrid relay is provided with a mechanical contact switch 12 with its contact switched by a driving unit, and a semiconductor switch 13 connected in parallel with th...

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Bibliographische Detailangaben
Hauptverfasser: SUMINO YASUHIRO, MATSUMIYA KEI, KUDO HIROYUKI, MIURA HIROSHI, SHIBATA KIWAMU, NAKANO SUSUMU, YAMATO HIROHARU
Format: Patent
Sprache:eng
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a hybrid relay capable of preventing a semiconductor switch from getting highly heated. SOLUTION: The hybrid relay is provided with a mechanical contact switch 12 with its contact switched by a driving unit, and a semiconductor switch 13 connected in parallel with the mechanical contact switch 12, having a first power-feeding path by the mechanical contact switch 12 and a second power-feeding path by the semiconductor switch 13 connected in parallel as power-feeding paths supplying a load with a power source. It is provided with, for example, a thermal fuse F1 as a safety circuit section for opening the power-feeding path when temperature of the semiconductor switch becomes equal to or more than a prescribed temperature. COPYRIGHT: (C)2011,JPO&INPIT