CONNECTION METHOD AND CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To provide a connection method and a connection structure having superior connection reliability and adhesive strength. SOLUTION: In the connection method, a circuit connecting material 1, containing electrically conductive particles 7 is pinched by a first circuit member 20, in which a first circuit electrode 22 is formed on a first circuit board 21 and a second circuit member 30, in which a second circuit electrode 32 is formed on a second circuit board 31, in a state such that the first and the second circuit electrodes face each other and is heated and pressurized, and then the first and the second circuit members are jointed, and the first and the second circuit electrode are electrically connected via the conductive particles. The thickness of the first circuit board is 0.8 mm or less, and the thickness of the second circuit board is 15 μm or more; and if the thickness of the circuit connection material prior to heating and pressurizing is defines as T(μm), an average particle diameter of the conductive particles is R(μm), and the total thickness of the first and the second circuit electrodes is defines as H(μm), formula (1): 1.1≤T/R≤4.0, formula: (2) 0.5≤T/H, and formula (3): 1≤R≤7 are satisfied. COPYRIGHT: (C)2011,JPO&INPIT