GLASS FOR SEALING SEMICONDUCTOR, SHEATH TUBE FOR SEALING SEMICONDUCTOR, AND METHOD FOR SEALING SEMICONDUCTOR ELEMENT

PROBLEM TO BE SOLVED: To provide glass for sealing a semiconductor, the glass having low sealing temperature and practically sufficient chemical durability, particularly acid resistance, although the glass does not substantially contain PbO. SOLUTION: The glass for sealing a semiconductor contains,...

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Bibliographische Detailangaben
Hauptverfasser:	HASHIMOTO KOICHI, HIKATA HAJIME
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS METALLURGY MINERAL OR SLAG WOOL SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide glass for sealing a semiconductor, the glass having low sealing temperature and practically sufficient chemical durability, particularly acid resistance, although the glass does not substantially contain PbO. SOLUTION: The glass for sealing a semiconductor contains, as the glass composition, two or more kinds of alkali metal oxides (Li2O, Na2O and K2O), B2O3and Bi2O3but substantially no PbO. The glass shows a temperature of 660°C or lower at viscosity of 106dPa s, and has a coefficient of thermal expansion of 85 to 105×10-7/°C at 30 to 380°C. COPYRIGHT: (C)2011,JPO&INPIT