METHOD FOR MANUFACTURING HEAD GIMBAL ASSEMBLY, AND APPARATUS FOR CONNECTING CONNECTION PADS THEREOF TO EACH OTHER

PROBLEM TO BE SOLVED: To improve the productivity of a head gimbal assembly. SOLUTION: In one embodiment of the present invention, a soldering device 2 holds a solder ball at a suction port by sucking the solder ball 32 at the suction port 212 in a nozzle 21. An inert gas feed device 24 feeds inert...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser:	IMAI HIDETO, OSAWA HIDENORI, TSUCHIYA TATSUMI, YOSHIDA TATSUSHI, MATSUMOTO YUSUKE
Format:	Patent
Sprache:	eng
Schlagworte:	CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING INFORMATION STORAGE INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORDCARRIER AND TRANSDUCER MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PHYSICS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To improve the productivity of a head gimbal assembly. SOLUTION: In one embodiment of the present invention, a soldering device 2 holds a solder ball at a suction port by sucking the solder ball 32 at the suction port 212 in a nozzle 21. An inert gas feed device 24 feeds inert gas into the nozzle 21. A laser beam device 27 irradiates the solder ball separated from the suction port and carried downstream with the inert gas, with laser beam. Solder melted by irradiation with laser beam is deposited on two pads with the inert gas, and solidified. COPYRIGHT: (C)2011,JPO&INPIT