COUPLER
PROBLEM TO BE SOLVED: To provide a coupler which can be miniaturized and thinned while maintaining various requested characteristics of the coupler. SOLUTION: The coupler of this embodiment includes: a first line L1 which includes a coil-like main line L11 and is divided into different layers and ar...
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Sprache: | eng |
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Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a coupler which can be miniaturized and thinned while maintaining various requested characteristics of the coupler. SOLUTION: The coupler of this embodiment includes: a first line L1 which includes a coil-like main line L11 and is divided into different layers and arranged; a second line L2 which includes a coil-like sub line L21 arranged through an insulating layer to the main line L11 and is divided into different layers and arranged; a plurality of vias P11, P12, P21, P22 for connecting a part of the first line with each other and a part of the second line with each other, that are divided into different layers and arranged; and a plurality of terminals T11, T12, T21, T22 connected to the end parts of the first line L1 and the second line L2. The vias include a pull-out via P11 which passes through the insulating layer and is connected to the main line or the sub line, and the first line L1 and the second line L2 are pulled out to the same surface side of the insulating layer through the pull-out via P11. COPYRIGHT: (C)2011,JPO&INPIT |
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