METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board in which the generation of delamination is suppressed to obtain a multilayer wiring board low in wiring resistance (surface resistance). SOLUTION: The method of manufacturing the multilayer wiring board includes ste...

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Bibliographische Detailangaben
1. Verfasser:	FUJII SHUNICHI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board in which the generation of delamination is suppressed to obtain a multilayer wiring board low in wiring resistance (surface resistance). SOLUTION: The method of manufacturing the multilayer wiring board includes steps of preparing a die 1 which has a protrusion 11 with a wiring shape whose cross section is semicircle or half-ellipse, pressing the die 1 against a ceramic green sheet 2 to form a groove 21 on the ceramic green sheet 2, having a wiring shape whose cross section is semicircle or half-ellipse, filling the groove 21 with conductive paste 4 for wiring to manufacture a ceramic green sheet 5 with a wiring pattern, carrying out two or more lamination on the ceramic green sheet 5 with the wiring pattern to manufacture a laminate 6, and calcining the laminate 6. COPYRIGHT: (C)2011,JPO&INPIT