METHOD OF DICING SUBSTRATE

PROBLEM TO BE SOLVED: To provide a method of dicing a substrate, which can be implemented even by a dicing device having a small number of channels by: suppressing the occurrence of chipping and the crack of the substrate; and simplifying movement of a dicing blade in the width direction of the substrate. SOLUTION: The method of dicing the substrate includes a first step of obtaining divided pieces by dicing the substrate from one end to the other end sequentially in parallel to a width which is a multiple of 2n(n: a positive integer) of an individual piece size, and a second step of dicing the divided piece obtained in the first step to a width which is a multiple of 2n-1of the individual piece size, the second step being repeated until the divided piece has the same width as the size of the individual piece. COPYRIGHT: (C)2011,JPO&INPIT