RESIN-IMPREGNATED SHEET, LAMINATED SHEET AND MODULE
PROBLEM TO BE SOLVED: To provide a resin-impregnated sheet having excellent thermal conductivity because of the high filling of a filler, having a large thickness and suitably usable for a heat-radiating use, and to provide a laminated sheet and a module. SOLUTION: The resin-impregnated sheet 1 is o...
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| creator | BABA DAIZO SUZUE TAKAYUKI NOZUE AKIYOSHI SAWADA TOMOAKI |
| description | PROBLEM TO BE SOLVED: To provide a resin-impregnated sheet having excellent thermal conductivity because of the high filling of a filler, having a large thickness and suitably usable for a heat-radiating use, and to provide a laminated sheet and a module. SOLUTION: The resin-impregnated sheet 1 is obtained by impregnating a nonwoven fabric with a resin composition 2 containing 70-95 mass% of the filler, and forming the impregnated product into a B-stage state, and has a thickness of 200-500 μm. Preferably, the resin content is ≥90 mass%, and the nonwoven fabric is formed out of a fiber 3 having a ≤10 μm diameter and ≥13 mm length. The laminated sheet A is obtained by cladding a metal foil 4 at least on one surface side of the resin-impregnated sheet 1, and curing the resin. The module is obtained by mounting a component 10 on a circuit board formed by using the laminated sheet A. COPYRIGHT: (C)2011,JPO&INPIT |
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SOLUTION: The resin-impregnated sheet 1 is obtained by impregnating a nonwoven fabric with a resin composition 2 containing 70-95 mass% of the filler, and forming the impregnated product into a B-stage state, and has a thickness of 200-500 μm. Preferably, the resin content is ≥90 mass%, and the nonwoven fabric is formed out of a fiber 3 having a ≤10 μm diameter and ≥13 mm length. The laminated sheet A is obtained by cladding a metal foil 4 at least on one surface side of the resin-impregnated sheet 1, and curing the resin. The module is obtained by mounting a component 10 on a circuit board formed by using the laminated sheet A. 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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | RESIN-IMPREGNATED SHEET, LAMINATED SHEET AND MODULE |
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