RESIN-IMPREGNATED SHEET, LAMINATED SHEET AND MODULE

PROBLEM TO BE SOLVED: To provide a resin-impregnated sheet having excellent thermal conductivity because of the high filling of a filler, having a large thickness and suitably usable for a heat-radiating use, and to provide a laminated sheet and a module. SOLUTION: The resin-impregnated sheet 1 is o...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: BABA DAIZO, SUZUE TAKAYUKI, NOZUE AKIYOSHI, SAWADA TOMOAKI
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a resin-impregnated sheet having excellent thermal conductivity because of the high filling of a filler, having a large thickness and suitably usable for a heat-radiating use, and to provide a laminated sheet and a module. SOLUTION: The resin-impregnated sheet 1 is obtained by impregnating a nonwoven fabric with a resin composition 2 containing 70-95 mass% of the filler, and forming the impregnated product into a B-stage state, and has a thickness of 200-500 μm. Preferably, the resin content is ≥90 mass%, and the nonwoven fabric is formed out of a fiber 3 having a ≤10 μm diameter and ≥13 mm length. The laminated sheet A is obtained by cladding a metal foil 4 at least on one surface side of the resin-impregnated sheet 1, and curing the resin. The module is obtained by mounting a component 10 on a circuit board formed by using the laminated sheet A. COPYRIGHT: (C)2011,JPO&INPIT