METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD
PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, wherein an outer shape machining accuracy can be inspected without adding a special device and process and furthermore the factor of defect in outer shape machining can be specified and the degree of the defect can b...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Zusammenfassung: | PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, wherein an outer shape machining accuracy can be inspected without adding a special device and process and furthermore the factor of defect in outer shape machining can be specified and the degree of the defect can be investigated, and to provide a printed wiring board. SOLUTION: The method for manufacturing the printed wiring board includes a wiring pattern forming step of forming a conductor circuit 100 including a plurality of U-shaped conductors 10 and 20 which are arranged so as to be nested while openings 10f and 20f thereof are set in a same direction and providing terminal pads 12 and 22 which are arranged at both ends on each opening side of the conductors 10 and 20, respectively. COPYRIGHT: (C)2011,JPO&INPIT |
---|