METHOD FOR MANUFACTURING PRINTED WIRING BOARD, AND PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, wherein an outer shape machining accuracy can be inspected without adding a special device and process and furthermore the factor of defect in outer shape machining can be specified and the degree of the defect can b...

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1. Verfasser: KINOSHITA KAZUHIRO
Format: Patent
Sprache:eng
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a method for manufacturing a printed wiring board, wherein an outer shape machining accuracy can be inspected without adding a special device and process and furthermore the factor of defect in outer shape machining can be specified and the degree of the defect can be investigated, and to provide a printed wiring board. SOLUTION: The method for manufacturing the printed wiring board includes a wiring pattern forming step of forming a conductor circuit 100 including a plurality of U-shaped conductors 10 and 20 which are arranged so as to be nested while openings 10f and 20f thereof are set in a same direction and providing terminal pads 12 and 22 which are arranged at both ends on each opening side of the conductors 10 and 20, respectively. COPYRIGHT: (C)2011,JPO&INPIT