SHEET TYPE ADHESIVE AND TAPE FOR PROCESSING WAFER

PROBLEM TO BE SOLVED: To provide a sheet type adhesive having excellent adhesive force between a semiconductor chip and a lead frame, a package board or the like, and capturing ionic impurities in an adhesive layer, to provide a tape for processing a wafer, the tape produced by using the sheet type...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	MORISHIMA YASUMASA, ISHIGURO KUNIHIKO, ISHIWATARI SHINICHI
Format:	Patent
Sprache:	eng
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES TRANSPORTING USE OF MATERIALS AS ADHESIVES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a sheet type adhesive having excellent adhesive force between a semiconductor chip and a lead frame, a package board or the like, and capturing ionic impurities in an adhesive layer, to provide a tape for processing a wafer, the tape produced by using the sheet type adhesive, and to provide a semiconductor device manufactured by using the sheet type adhesive. SOLUTION: The sheet type adhesive 12 contains a chelate-modified curable resin modified with a chelate as an adhesive layer composition, wherein the compounding ratio of the chelate-modified epoxy resin with respect to the curable resin component is not more than 10 mass%, and the amount of a component of a high molecular weight compound having a weight-average molecular weight of not less than 100,000 is 40 to 100 pts.mass with respect to 100 pts.mass of the curable resin component. COPYRIGHT: (C)2011,JPO&INPIT